77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
Advanced PCB · Advanced Materials
Rogers
Circuit boards built on Rogers laminates for RF and microwave designs.
Advanced Materials
Rogers with ShinePCB
Rogers materials are widely used where stable dielectric properties and low loss are needed. We select a grade with you based on frequency, loss and thermal targets, discuss hybrid builds and check availability before quotation.
- Grade selection for your targets
- Hybrid stack-ups with FR-4
- Processing requirements
- Material availability
Capability and certificates
| Positioning | RF / Microwave | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| Rogers | RO3003/3006/3010/3035, RO4003C, RO4350B, RO4360G2, RO4835, RO4450 | Available on Request |
Related certificates
- IECQ QC 080000IECQ-H NQAGB 25.0038
- REACH/SVHCSupported via Partner Manufacturing Network
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Rogers laminates
| Material | Series | Tg | Dk | Df | Typical use |
|---|---|---|---|---|---|
| Rogers RO3003 | RO3000 | — | 3.00 @ 10 GHz | 0.0013 | Microwave and RF |
| Rogers RO3006 | RO3000 | — | 6.15 @ 10 GHz | — | Microwave and RF |
| Rogers RO3010 | RO3000 | — | 10.2 @ 10 GHz | — | Microwave and RF |
| Rogers RO3035 | RO3000 | — | 3.50 @ 10 GHz | 0.0017 | Microwave and RF |
| Rogers RO4003C | RO4000 | >280 °C | 3.38 (process Dk) @ 10 GHz | 0.0027 | RF and microwave; hybrid boards |
| Rogers RO4350B | RO4000 | >280 °C | 3.48 (process Dk) @ 10 GHz | 0.0037 | RF and microwave; hybrid boards |
| Rogers RO4360G2 | RO4000 | — | — | — | RF and microwave; hybrid boards |
| Rogers RO4835 | RO4000 | — | — | — | RF and microwave; hybrid boards |
| Rogers RO4450 | Bonding material | — | — | — | RF hybrid lamination bonding |
Source: ShinePCB capability workbook, material sheet. Dk, Df and Tg are typical supplier datasheet values (test frequency shown where the source lists it). They describe the laminate, not the finished board. Grades are available on request and confirmed with availability during engineering review. "—" means no value is listed in the source.
Builds on Rogers materials
Board constructions from the ShinePCB company presentation — not customer references.
AI server high-speed board
- Layers
- 18
- Material
- Panasonic MEGTRON 8
- Thickness / min hole
- 3.1 mm / 0.15 mm
- Finish
- Full-board electrolytic hard gold
- Challenge
- High layer count, blind vias, thick gold over the full board
12-layer rigid-flex board
- Structure
- 12 layers, 4R + 4F + 4R
- Materials
- ITEQ IT-180 + DuPont AP9141R
- Thickness / min hole
- 1.6 mm / 0.2 mm
- Finish
- Immersion gold (ENIG)
- Application
- High-end industrial connector
Millimeter-wave antenna board
- Layers
- 8
- Material
- Rogers RT5880
- Finish
- Soft gold plating, 3 µm gold
- Special process
- Laser profiling
5G base-station power amplifier board
- Layers
- 4
- Materials
- Rogers RO4350B + FR-4
- Finish
- Immersion gold (ENIG)
- Special process
- Blind vias, step cavity, partially embedded copper block
Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Typical applications
Antennas and RF modules
Radar sensors
Satellite and wireless equipment
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
Rogers FAQs
Can I specify an exact Rogers grade?
Yes. Specify the grade and we will confirm availability and processing during review.
Are datasheet values guaranteed?
Supplier values are material data, not fabrication guarantees.
